Co-packaged optics remains in a very early adoption phase

Conviction: 55% · Horizon: 5Y · 2026-07-04
Silicon-on-insulator substrates are a bottleneck enabler for advanced photonics in CPO

As hyperscale and AI clusters push bandwidth inside the rack, co-packaged optics will need specialized SOI wafers. A near-monopoly supplier of SOI can capture durable economics before the market fully scales.

Instrument Side Target Reason
SOI.PA Long SOI is a differentiated input for high-performance silicon photonics; limited competition and rising CPO intensity support pricing power and volume growth over a multi-year buildout.
MOCVD equipment suppliers benefit from whichever player wins the laser and transceiver race

CPO adoption depends on efficient III-V epitaxy for lasers and optical components. Leading MOCVD tool vendors sit upstream of competing chip and module designs, so volume growth is less tied to a single winner.

Instrument Side Target Reason
AIXA.DE Long Dominant MOCVD positioning makes the company a picks-and-shovels play on CPO and high-speed optical buildout, with demand driven by multiple laser and transceiver roadmaps rather than one design win.

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