Co-packaged optics adoption is still in its infancy

Conviction: 65% · Horizon: 5Y · 2026-07-04
CPO supply chain winners sit in substrates and specialty materials

As hyperscale AI clusters push bandwidth and power limits, co-packaged optics should scale from niche pilots toward mainstream switch and accelerator designs. Early-cycle exposure favors suppliers with durable process moats in engineered wafers and photonic substrates rather than commoditized assembly.

Instrument Side Target Reason
SOI.PA Long Engineered silicon-on-insulator and related wafer platforms are a bottleneck input for advanced photonic integration; a supplier with scale and limited competition can capture rising volume and pricing as CPO ramps.

Themes

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