High-speed connectivity chips favored over memory in AI infrastructure

Conviction: 65% · Horizon: 2Y · 2026-07-07
Credo offers better exposure than Micron as data-center build-out stresses interconnect and SerDes over commodity DRAM cycles

Memory suppliers face cyclical oversupply and pricing pressure even as AI capex rises, while vendors of active electrical cables and high-speed retimers capture structural demand from denser GPU clusters and faster rack-to-rack links.

Instrument Side Target Reason
CRDO Long Specialized connectivity and signal-conditioning silicon scales with AI cluster bandwidth needs and is less hostage to DRAM inventory swings than pure memory plays.
MU Short Commodity memory earnings remain volatile through build-and-bust inventory cycles, diluting the quality of AI-themed exposure relative to upstream interconnect leaders.

Themes

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